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Epidermal Electronics: Calcium‐Modified Silk as a Biocompatible and Strong Adhesive for Epidermal Electronics (Adv. Funct. Mater. 36/2018)
Author(s) -
Seo JiWon,
Kim Hyojung,
Kim KyuHan,
Choi Siyoung Q.,
Lee Hyunjoo J.
Publication year - 2018
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201870250
Subject(s) - materials science , fibroin , adhesive , silk , biocompatibility , biocompatible material , electronics , nanotechnology , flexible electronics , composite material , biomedical engineering , layer (electronics) , medicine , chemistry , metallurgy
In article number 1800802 , Hyunjoo J. Lee and co‐workers present a calcium‐modified silk fibroin film as a strong adhesive for next‐generation epidermal electronics. The modified silk film exhibits viscoelastic properties and can mechanically interlock a sensor and the skin surface ∼20 times stronger than commercial alternatives. Additional interesting characteristics, such as good biocompatibility, reusability, stretchability, and conductivity show promise for widespread application.