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Tuning Contact Resistance in Top‐Contact p ‐Type and n ‐Type Organic Field Effect Transistors by Self‐Generated Interlayers
Author(s) -
Sarkar Tanmoy,
Shamieh Basel,
Verbeek Roy,
Kronemeijer Auke Jisk,
Gelinck Gerwin H.,
Frey Gitti L.
Publication year - 2020
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201805617
Subject(s) - materials science , contact resistance , x ray photoelectron spectroscopy , organic field effect transistor , nanotechnology , optoelectronics , work function , organic electronics , thin film transistor , contact angle , transistor , field effect transistor , layer (electronics) , chemical engineering , composite material , electrical engineering , voltage , engineering
Contact resistance significantly limits the performance of organic field‐effect transistors (OFETs). Positioning interlayers at the metal/organic interface can tune the effective work‐function and reduce contact resistance. Myriad techniques offer interlayer processing onto the metal pads in bottom‐contact OFETs. However, most methods are not suitable for deposition on organic films and incompatible with top‐contact OFET architectures. Here, a simple and versatile methodology is demonstrated for interlayer processing in both p‐ and n‐type devices that is also suitable for top‐contact OFETs. In this approach, judiciously selected interlayer molecules are co‐deposited as additives in the semiconducting polymer active layer. During top contact deposition, the additive molecules migrate from within the bulk film to the organic/metal interface due to additive‐metal interactions. Migration continues until a thin continuous interlayer is completed. Formation of the interlayer is confirmed by X‐ray photoelectron spectroscopy (XPS) and cross‐section scanning transmission electron microscopy (STEM), and its effect on contact resistance by device measurements and transfer line method (TLM) analysis. It is shown that self‐generated interlayers that reduce contact resistance in p‐type devices, increase that of n‐type devices, and vice versa, confirming the role of additives as interlayer materials that modulate the effective work‐function of the organic/metal interface.