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Mechanically Guided Post‐Assembly of 3D Electronic Systems
Author(s) -
Kim Bong Hoon,
Liu Fei,
Yu Yongjoon,
Jang Hokyung,
Xie Zhaoqian,
Li Kan,
Lee Jungyup,
Jeong Ji Yoon,
Ryu Arin,
Lee Yechan,
Kim Do Hoon,
Wang Xueju,
Lee KunHyuck,
Lee Jong Yoon,
Won Sang Min,
Oh Nuri,
Kim Jeonghyun,
Kim Ju Young,
Jeong SeongJun,
Jang KyungIn,
Lee Seungmin,
Huang Yonggang,
Zhang Yihui,
Rogers John A.
Publication year - 2018
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201803149
Subject(s) - flexible electronics , materials science , planar , leverage (statistics) , stretchable electronics , electronics , computer science , substrate (aquarium) , printed circuit board , nanotechnology , mechanical engineering , electrical engineering , engineering , computer graphics (images) , artificial intelligence , operating system , oceanography , geology
This paper describes deterministic assembly processes for transforming conventional, planar devices based on flexible printed circuit board (FPCB) platforms into those with 3D architectures in a manner that is fully compatible with off‐the‐shelf packaged or unpackaged component parts. The strategy involves mechanically guided geometry transformation by out‐of‐plane buckling motions that follow from controlled forces imposed at precise locations across the FPCB substrate by a prestretched elastomer platform. The geometries and positions of cuts, slits, and openings defined into the FPCB provide additional design parameters to control the final 3D layouts. The mechanical tunability of the resulting 3D FPCB platforms, afforded by elastic deformations of the substrate, allows these electronic systems to operate in an adaptable manner, as demonstrated in simple examples of an optoelectronic sensor that offers adjustable detecting angle/area and a near‐field communication antenna that can be tuned to accommodate changes in the electromagnetic properties of its surroundings. These approaches to 3D FPCB technologies create immediate opportunities for designs in multifunctional systems that leverage state‐of‐the‐art components.