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Mechanically Robust, Ultraelastic Hierarchical Foam with Tunable Properties via 3D Printing
Author(s) -
Chen Qiyi,
Cao PengFei,
Advincula Rigoberto C.
Publication year - 2018
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201800631
Subject(s) - materials science , composite material , porosity , polyurethane , 3d printing , coating , electrical conductor , inkwell , thixotropy , adhesive , nanoparticle , nanotechnology , layer (electronics)
A mechanically robust, ultraelastic foam with controlled multiscale architectures and tunable mechanical/conductive performance is fabricated via 3D printing. Hierarchical porosity, including both macro‐ and microscaled pores, are produced by the combination of direct ink writing (DIW), acid etching, and phase inversion. The thixotropic inks in DIW are formulated by a simple one‐pot process to disperse duo nanoparticles (nanoclay and silica nanoparticles) in a polyurethane suspension. The resulting lightweight foam exhibits tailorable mechanical strength, unprecedented elasticity (standing over 1000 compression cycles), and remarkable robustness (rapidly and fully recover after a load more than 20 000 times of its own weight). Surface coating of carbon nanotubes yields a conductive elastic foam that can be used as piezoresistivity sensor with high sensitivity. For the first time, this strategy achieves 3D printing of elastic foam with controlled multilevel 3D structures and mechanical/conductive properties. Moreover, the facile ink preparation method can be utilized to fabricate foams of various materials with desirable performance via 3D printing.