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Extreme Two‐Phase Cooling from Laser‐Etched Diamond and Conformal, Template‐Fabricated Microporous Copper
Author(s) -
Palko James W.,
Lee Hyoungsoon,
Zhang Chi,
Dusseault Tom J.,
Maitra Tanmoy,
Won Yoonjin,
Agonafer Damena D.,
Moss Jess,
Houshmand Farzad,
Rong Guoguang,
Wilbur Joshua D.,
Rockosi Derrick,
Mykyta Ihor,
Resler Dan,
Altman David,
Asheghi Mehdi,
Santiago Juan G.,
Goodson Kenneth E.
Publication year - 2017
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201703265
Subject(s) - materials science , heat sink , diamond , thermal conductivity , boiling , heat transfer , microporous material , composite material , thermodynamics , physics
This paper reports the first integration of laser‐etched polycrystalline diamond microchannels with template‐fabricated microporous copper for extreme convective boiling in a composite heat sink for power electronics and energy conversion. Diamond offers the highest thermal conductivity near room temperature, and enables aggressive heat spreading along triangular channel walls with 1:1 aspect ratio. Conformally coated porous copper with thickness 25 µm and 5 µm pore size optimizes fluid and heat transport for convective boiling within the diamond channels. Data reported here include 1280 W cm −2 of heat removal from 0.7 cm 2 surface area with temperature rise beyond fluid saturation less than 21 K, corresponding to 6.3 × 10 5 W m −2 K −1 . This heat sink has the potential to dissipate much larger localized heat loads with small temperature nonuniformity (5 kW cm −2 over 200 µm × 200 µm with <3 K temperature difference). A microfluidic manifold assures uniform distribution of liquid over the heat sink surface with negligible pumping power requirements (e.g., <1.4 × 10 −4 of the thermal power dissipated). This breakthrough integration of functional materials and the resulting experimental data set a very high bar for microfluidic heat removal.