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All‐Layered 2D Optoelectronics: A High‐Performance UV–vis–NIR Broadband SnSe Photodetector with Bi 2 Te 3 Topological Insulator Electrodes
Author(s) -
Yao Jiandong,
Zheng Zhaoqiang,
Yang Guowei
Publication year - 2017
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201701823
Subject(s) - photodetector , materials science , topological insulator , responsivity , optoelectronics , specific detectivity , dangling bond , van der waals force , heterojunction , silicon , physics , condensed matter physics , quantum mechanics , molecule
Nanoelectronics is in urgent demand of exceptional device architecture with ultrathin thickness below 10 nm and dangling‐bond‐free surface to break through current physical bottleneck and achieve new record of integration level. The advance in 2D van der Waals materials endows scientists with new accessibility. This study reports an all‐layered 2D Bi 2 Te 3 ‐SnSe‐Bi 2 Te 3 photodetector, and the broadband photoresponse of the device from ultraviolet (370 nm) to near‐infrared (808 nm) is demonstrated. In addition, the optimized responsivity reaches 5.5 A W −1 , with the corresponding eternal quantum efficiency of 1833% and detectivity of 6 × 10 10 cm Hz 1/2 W −1 . These figures‐of‐merits are among the best values of the reported all‐layered 2D photodetectors, which are several orders of magnitude higher than those of the previous SnSe photodetectors. The superior device performance is attributed to the synergy of highly conductive surface state of Bi 2 Te 3 topological insulator, perfect band alignment between Bi 2 Te 3 and SnSe as well as small interface potential fluctuation. Meanwhile, the all‐layered 2D device is further constructed onto flexible mica substrate and its photoresponse is maintained roughly unchanged upon 60 bending cycles. The findings represent a fundamental scenario for advancement of the next generation high performance and high integration level flexible optoelectronics.