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Graphene Transfer: Wetting‐Assisted Crack‐ and Wrinkle‐Free Transfer of Wafer‐Scale Graphene onto Arbitrary Substrates over a Wide Range of Surface Energies (Adv. Funct. Mater. 13/2016)
Author(s) -
Kim Hyun Ho,
Lee Seong Kyu,
Lee Seung Goo,
Lee Eunho,
Cho Kilwon
Publication year - 2016
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201670077
Subject(s) - graphene , materials science , wetting , transfer printing , wafer , surface tension , nanotechnology , graphene foam , composite material , graphene oxide paper , optoelectronics , thermodynamics , physics
Transfer of high‐quality and uniform large‐area graphene onto arbitrary substrates is essential to improve the electrical performances and yields of graphene‐based electronic devices. On page 2070, K. Cho and co‐workers investigate the mechanisms of transfer‐induced graphene defects and develop a novel transfer method using a low‐surface tension solvent as a transfer medium liquid to minimize the graphene defects even onto superhydrophobic or flexible substrates, leading to great improvement of the electrical and mechanical properties.