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Multifunctional Three‐Dimensional T‐Junction Graphene Micro‐Wells: Energy‐Efficient, Plasma‐Enabled Growth and Instant Water‐Based Transfer for Flexible Device Applications
Author(s) -
Kumar Shailesh,
van der Laan Timothy,
Rider Amanda Evelyn,
Randeniya Lakshman,
Ostrikov Kostya Ken
Publication year - 2014
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201400992
Subject(s) - graphene , materials science , plasma , nanotechnology , optoelectronics , chemical engineering , physics , quantum mechanics , engineering
The “third‐generation” 3D graphene structures, T‐junction graphene micro‐wells (T‐GMWs) are produced on cheap polycrystalline Cu foils in a single‐step, low‐temperature (270 °C), energy‐efficient, and environment‐friendly dry plasma‐enabled process. T‐GMWs comprise vertical graphene (VG) petal‐like sheets that seemlessly integrate with each other and the underlying horizontal graphene sheets by forming T‐junctions. The microwells have the pico‐to‐femto‐liter storage capacity and precipitate compartmentalized PBS crystals. The T‐GMW films are transferred from the Cu substrates, without damage to the both, in de‐ionized or tap water, at room temperature, and without commonly used sacrificial materials or hazardous chemicals. The Cu substrates are then re‐used to produce similar‐quality T‐GMWs after a simple plasma conditioning. The isolated T‐GMW films are transferred to diverse substrates and devices and show remarkable recovery of their electrical, optical, and hazardous NO 2 gas sensing properties upon repeated bending (down to 1 mm radius) and release of flexible trasparent display plastic substrates. The plasma‐enabled mechanism of T‐GMW isolation in water is proposed and supported by the Cu plasma surface modification analysis. Our GMWs are suitable for various optoelectronic, sesning, energy, and biomedical applications while the growth approach is potentially scalable for future pilot‐scale industrial production.