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Ultrathin Sticker‐Type ZnO Thin Film Transistors Formed by Transfer Printing via Topological Confinement of Water‐Soluble Sacrificial Polymer in Dimple Structure
Author(s) -
Kim Suk Ho,
Yoon Jongwon,
Yun Su Ok,
Hwang Youngkyu,
Jang Hun Soo,
Ko Heung Cho
Publication year - 2013
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201202409
Subject(s) - materials science , transfer printing , substrate (aquarium) , dimple , inkwell , polymer substrate , nanotechnology , polymer , printed electronics , flexible electronics , transistor , layer (electronics) , thin film , optoelectronics , composite material , electrical engineering , oceanography , engineering , voltage , geology
To create ultrathin sticker‐type electronic devices that can be attached to unconventional substrates, it is highly desirable to develop printable membrane‐type electronics on a handling substrate and then transfer the printing to a target surface. A facile method is presented for high‐efficiency transfer printing by controlling the interfacial adhesion between a handling substrate and an ultrathin substrate in a systematic manner under mild conditions. A water‐soluble sacrificial polymer layer is employed on a dimpled handling substrate, which enables the topological confinement of the polymer residue inside and near the dimples during the etching and drying processes to reduce the interfacial adhesion gently, creating a high yield of transfer printing in a deterministic manner. As an example of an electronic device that was created using this method, a highly flexible sticker‐type ZnO thin film transistor was successfully developed with a thickness of 13 μm including a printable ultrathin substrate, which can be attached to various substrates, such as paper, plastic, and stickers.