Premium
Silicon Microstructures: Detachment Lithography of Photosensitive Polymers: A Route to Fabricating Three‐Dimensional Structures (Adv. Funct. Mater. 2/2010)
Author(s) -
Yeom Junghoon,
Shan Mark A.
Publication year - 2010
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.201090000
Subject(s) - polydimethylsiloxane , materials science , photoresist , lithography , reactive ion etching , scanning electron microscope , pyramid (geometry) , etching (microfabrication) , silicon , nanotechnology , optoelectronics , optics , composite material , layer (electronics) , physics
The scanning electron microscope image featured on the front cover shows a three‐dimensional polydimethylsiloxane (PDMS) molded film bonded on a glass rod. Multilevel silicon structures used to mold the PDMS film were fabricated from successive steps of detachment lithography of photoresist films, which are patterned with lithography and reactive ion etching, as reported by J. Yeom and M. A. Shannon on page 289 . The smallest feature on the pyramid is 2 µm in diameter.