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Printable Electronics: Foldable Printed Circuit Boards on Paper Substrates (Adv. Funct. Mater. 1/2010)
Author(s) -
Siegel Adam C.,
Phillips Scott T.,
Dickey Michael D.,
Lu Nanshu,
Suo Zhigang,
Whitesides George M.
Publication year - 2010
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.200990114
Subject(s) - printed circuit board , materials science , electronics , flexible electronics , microfluidics , printed electronics , 3d printed , optoelectronics , nanotechnology , cover (algebra) , electrical engineering , composite material , mechanical engineering , inkwell , biomedical engineering , engineering
Lightweight and flexible printed circuit boards (PCBs) have been produced by micro‐patterning metal on paper substrates, as reported by Siegel et al. on page 28 . Paper‐based electronic devices can be folded and creased repeatedly, shaped to form three‐dimensional structures, integrated with paper‐based microfluidic devices, and disposed of by flame (as shown in the cover image).