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Printable Single‐Crystal Silicon Micro/Nanoscale Ribbons, Platelets and Bars Generated from Bulk Wafers
Author(s) -
Baca A. J.,
Meitl M. A.,
Ko H. C.,
Mack S.,
Kim H.S.,
Dong J.,
Ferreira P. M.,
Rogers J. A.
Publication year - 2007
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.200601161
Subject(s) - materials science , wafer , etching (microfabrication) , nanotechnology , crystal (programming language) , optoelectronics , silicon , nanoscopic scale , transfer printing , composite material , layer (electronics) , computer science , programming language
This article demonstrates a method for fabricating high quality single‐crystal silicon ribbons, platelets and bars with dimensions between ∼ 100 nm and ∼ 5 cm from bulk (111) wafers by using phase shift and amplitude photolithographic methods in conjunction with anisotropic chemical etching procedures. This “top‐down” approach affords excellent control over the thicknesses, lengths, and widths of these structures and yields almost defect‐free, monodisperse elements with well defined doping levels, surface morphologies and crystalline orientations. Dry transfer printing these elements from the source wafers to target substrates by use of soft, elastomeric stamps enables high yield integration onto wafers, glass plates, plastic sheets, rubber slabs or other surfaces. As one application example, bottom gate thin‐film transistors that use aligned arrays of ribbons as the channel material exhibit good electrical properties, with mobilites as high as ∼ 200 cm 2 V –1 s –1 and on/off ratios > 10 4 .