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Formation of Metal Nano‐ and Micropatterns on Self‐Assembled Monolayers by Pulsed Laser Deposition Through Nanostencils and Electroless Deposition
Author(s) -
Speets E. A.,
te Riele P.,
van den Boogaart M. A. F.,
Doeswijk L. M.,
Ravoo B. J.,
Rijnders G.,
Brugger J.,
Reinhoudt D. N.,
Blank D. H. A.
Publication year - 2006
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.200500933
Subject(s) - materials science , monolayer , deposition (geology) , x ray photoelectron spectroscopy , noble metal , pulsed laser deposition , nanotechnology , metal , self assembled monolayer , nano , electroless deposition , micrometer , chemical engineering , thin film , optics , metallurgy , composite material , paleontology , sediment , engineering , biology , physics
Patterns of noble‐metal structures on top of self‐assembled monolayers (SAMs) on Au and SiO 2 substrates have been prepared following two approaches. The first approach consists of pulsed laser deposition (PLD) of Pt, Pd, Au, or Cu through nano‐ and microstencils. In the second approach, noble‐metal cluster patterns deposited through nano‐ and microstencils are used as catalysts for selective electroless deposition (ELD) of Cu. Cu structures are grown on SAMs on both Au and SiO 2 substrates and are subsequently analyzed using X‐ray photoelectron spectroscopy element mapping, atomic force microscopy, and optical microscopy. The combination of PLD through stencils on SAMs followed by ELD is a new method for the creation of (sub)‐micrometer‐sized metal structures on top of SAMs. This method minimizes the gas‐phase deposition step, which is often responsible for damage to, or electrical shorts through, the SAM.