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Two‐Dimensionally Ordered Copper Grid Patterns Prepared via Electroless Deposition Using a Colloidal‐Crystal Film as the Template
Author(s) -
Cong H. L.,
Cao W. X.
Publication year - 2005
Publication title -
advanced functional materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 6.069
H-Index - 322
eISSN - 1616-3028
pISSN - 1616-301X
DOI - 10.1002/adfm.200400603
Subject(s) - materials science , copper , wafer , deposition (geology) , porosity , colloidal crystal , colloid , nanotechnology , chemical engineering , composite material , metallurgy , paleontology , sediment , engineering , biology
Two‐dimensionally ordered copper grid patterns with different pore sizes and thickness have been fabricated via electroless copper deposition using a colloidal‐crystal film as the template. The pore size of the grid can be adjusted by altering the deposition time. The copper films, with thicknesses of ≈ 100–130 nm and pore sizes of ≈ 100 nm, are flexible and can be peeled off a silicon wafer and rolled up into a reel. Three‐dimensionally ordered porous copper materials have also been prepared using a similar method.