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Thermally Activated Jamming in Ultrasonic Powder Compaction
Author(s) -
Ward Austin A.,
Hareland Christopher A.,
Palmerio Nathan E.,
Cordero Zachary C.
Publication year - 2021
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.202001019
Subject(s) - materials science , compaction , jamming , hardening (computing) , ultrasonic sensor , composite material , softening , alloy , iron powder , thermal , nanocrystalline material , condensed matter physics , nanotechnology , thermodynamics , physics , layer (electronics) , acoustics
Herein, the role of thermal softening in ultrasonic powder compaction is assessed by comparing the densification behaviors of nominally pure Cu and a thermally stable CuTa alloy. These materials have similar thermal properties, but pure Cu softens at much lower temperatures than does the CuTa alloy. Using a specialized ultrasonic powder compaction setup, in situ measurements of relative density, sonotrode power consumption, and temperature are collected, which together provide a time‐dependent geometric hardening parameter that reflects the structure of the compact. The geometric hardening data for the pure Cu powder reveal three distinct stages of densification: an initial particle rearrangement stage; a jamming transition where strong junctions develop between particles; and a final stage characterized by compatible plastic deformation. By contrast, the geometric hardening data for the thermally stable CuTa powder show that it remains a weak fluidized granular medium, despite experiencing higher normal pressures, oscillation amplitudes, and temperatures. The contrasting behaviors of the Cu and the CuTa powders suggest that a thermally activated jamming transition drives interparticle junction growth and densification in ultrasonic powder compaction.