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Investigating Porous Media for Relief Printing Using Micro‐Architected Materials
Author(s) -
Gallegos Michael A.,
Garcia Chelsea M.,
Schunk Peter Randall,
White Benjamin C.,
Boyce Brad L.,
Secor Ethan B.,
Kaehr Bryan
Publication year - 2020
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.202000548
Subject(s) - microscale chemistry , transfer printing , materials science , 3d printing , nanotechnology , inkwell , porosity , nanoscopic scale , printed electronics , scalability , electronics , computer science , mechanical engineering , process engineering , engineering , composite material , mathematics education , mathematics , database , electrical engineering
Advances in printed electronics are predicated on the integration of sophisticated printing technologies with functional materials. Although scalable manufacturing methods, such as letterpress and flexographic printing, have significant history in graphic arts printing, functional applications require sophisticated control and understanding of nanoscale transfer of fluid inks. Herein, a versatile platform is introduced to study and engineer printing forms, exploiting a microscale additive manufacturing process to design micro‐architected materials with controllable porosity and deformation. Building on this technology, controlled ink transfer for submicron functional films is demonstrated. The design freedom and high‐resolution 3D control afforded by this method provide a rich framework for studying mechanics of fluid transfer for advanced manufacturing processes.