Premium
The Effect of a Small Copper Addition on the Electrical Conductivity of Aluminum
Author(s) -
Lapovok Rimma,
Berner Alex,
Qi Yuanshen,
Xu Chunjee,
Rabkin Eugen,
Beygelzimer Yan
Publication year - 2020
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.202000058
Subject(s) - copper , materials science , extrusion , electrical resistivity and conductivity , aluminium , compaction , intermetallic , metallurgy , agglomerate , conductivity , composite material , alloy , chemistry , electrical engineering , engineering
Aluminum powder blended with 10, 20, and 30 wt% of copper powder is compacted at 400 °C by four reciprocal extrusion passes. Simultaneous compaction and strengthening result in more than double increase in mechanical strength characteristics for 20 and 30 wt% of copper and a significant increase in electrical conductivity for 30 wt% of copper. This phenomenon is investigated here by the expansion of the “effective media” model for a random binary mixture so that it includes the presence of intermetallic phases and considers the distribution of large copper agglomerates.