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Back Cover: Advanced Engineering Materials 7∕2018
Publication year - 2018
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201870021
Subject(s) - schematic , cover (algebra) , materials science , ceramic , sintering , mechanical engineering , engineering physics , composite material , engineering , electrical engineering
With the introduction of cold sintering process (CSP), it's possible to co‐sinter Teflon polymer (molecular structure on the left) and ZnO ceramic (crystal structure on the right) composite with a high amount of ceramic phase at a temperature lower than 300 °C. It's shown that Teflon is distributed around the grain boundaries of ZnO in the cold sintered Teflon‐ZnO composite (EDS map on the right and schematic at the bottom), leading to a non‐ohmic characteristic. Further details can be found in the article 1700902 by Clive Randall and co‐workers.