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Back Cover: Advanced Engineering Materials 3∕2018
Publication year - 2018
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201870008
Subject(s) - cover (algebra) , thermal conductivity , computer science , materials science , mechanical engineering , engineering physics , composite material , engineering
Advanced thermal interface material comprised of dense and orderly arrays of 10‐μm high Cu nanosprings with tunable normal and shear compliance and high thermal conductivity. This combination of properties makes it possible to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus. Further details can be found in the article 1700910 by Ioannis Chasiotis and co‐workers.