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Characterization of Special Grain Boundaries and Triple Junctions in Cu x Ni 1‐ x Alloys upon Deformation and Annealing
Author(s) -
Emeis Friederike,
Leuthold Jörn,
Spangenberg Katharina,
Peterlechner Martin,
Wilde Gerhard
Publication year - 2019
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201801214
Subject(s) - triple junction , materials science , microstructure , grain boundary , annealing (glass) , grain size , crystallography , condensed matter physics , metallurgy , physics , chemistry , optoelectronics
We compare two quantities to describe a microstructure: the length fraction of Σ 3/ Σ 9‐grain boundaries and the number fraction of Σ 3‐x‐x/ Σ 3‐ Σ 3‐ Σ 9‐triple junctions using Cu, Ni and four of their alloys in several microstructural states. The fractions of Σ 3‐grain boundaries show similar tendencies as the respective fractions of Σ 3‐x‐x‐triple junctions in relation to the grain size upon deformation and annealing. However, the fraction of Σ 9‐grain boundaries stagnates at certain grain sizes, while there is still a considerable change of Σ 3‐ Σ 3‐ Σ 9‐triple junctions during grain growth, meaning that the Σ 3‐ Σ 3‐ Σ 9‐triple junction microstructure is still evolving. To analyze the evolution of the triple junction microstructure, a program, such as pythorient, is necessary.