Characterization of Special Grain Boundaries and Triple Junctions in Cu  x  Ni 1‐ x   Alloys upon Deformation and Annealing | Zendy

Emeis Friederike | Zendy; Leuthold Jörn | Zendy; Spangenberg Katharina | Zendy; Peterlechner Martin | Zendy; Wilde Gerhard | Zendy

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Characterization of Special Grain Boundaries and Triple Junctions in Cu x Ni 1‐ x Alloys upon Deformation and Annealing

Author(s) -

Emeis Friederike,

Leuthold Jörn,

Spangenberg Katharina,

Peterlechner Martin,

Wilde Gerhard

Publication year - 2019

Publication title -

advanced engineering materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.938

H-Index - 114

eISSN - 1527-2648

pISSN - 1438-1656

DOI - 10.1002/adem.201801214

Subject(s) - triple junction , materials science , microstructure , grain boundary , annealing (glass) , grain size , crystallography , condensed matter physics , metallurgy , physics , chemistry , optoelectronics

We compare two quantities to describe a microstructure: the length fraction of Σ 3/ Σ 9‐grain boundaries and the number fraction of Σ 3‐x‐x/ Σ 3‐ Σ 3‐ Σ 9‐triple junctions using Cu, Ni and four of their alloys in several microstructural states. The fractions of Σ 3‐grain boundaries show similar tendencies as the respective fractions of Σ 3‐x‐x‐triple junctions in relation to the grain size upon deformation and annealing. However, the fraction of Σ 9‐grain boundaries stagnates at certain grain sizes, while there is still a considerable change of Σ 3‐ Σ 3‐ Σ 9‐triple junctions during grain growth, meaning that the Σ 3‐ Σ 3‐ Σ 9‐triple junction microstructure is still evolving. To analyze the evolution of the triple junction microstructure, a program, such as pythorient, is necessary.

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