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A Simulation Study of the Stresses in Crystalline Silicon Photovoltaic Laminates during the Soldering and Lamination Processes Along the Longitudinal Direction
Author(s) -
Ridhuan Song Wenjian M.,
Tippabhotla Sasi Kumar,
Tay Andrew Ah Ong,
Budiman Arief Suriadi
Publication year - 2019
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201800986
Subject(s) - materials science , lamination , interconnection , composite material , soldering , silicon , residual stress , stress (linguistics) , photovoltaic system , fracture (geology) , structural engineering , optoelectronics , electrical engineering , layer (electronics) , engineering , telecommunications , linguistics , philosophy
The fracture of silicon cells is a common reliability issue found in silicon‐based photovoltaic (PV) modules. Cracks initiate and propagate as a result of high residual stresses in silicon cells and cause power losses. In this study, the stresses in the longitudinal cross‐section of a PV laminate during the soldering and lamination processes are simulated and studied. A parametric study of the effect of interconnect thickness and yield strength is also performed and the results show that a peak maximum stress is reached at a certain interconnect to cell thickness ratio.