A Simulation Study of the Stresses in Crystalline Silicon Photovoltaic Laminates during the Soldering and Lamination Processes Along the Longitudinal Direction | Zendy

Ridhuan Song Wenjian M. | Zendy; Tippabhotla Sasi Kumar | Zendy; Tay Andrew Ah Ong | Zendy; Budiman Arief Suriadi | Zendy

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A Simulation Study of the Stresses in Crystalline Silicon Photovoltaic Laminates during the Soldering and Lamination Processes Along the Longitudinal Direction

Author(s) -

Ridhuan Song Wenjian M.,

Tippabhotla Sasi Kumar,

Tay Andrew Ah Ong,

Budiman Arief Suriadi

Publication year - 2019

Publication title -

advanced engineering materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.938

H-Index - 114

eISSN - 1527-2648

pISSN - 1438-1656

DOI - 10.1002/adem.201800986

Subject(s) - materials science , lamination , interconnection , composite material , soldering , silicon , residual stress , stress (linguistics) , photovoltaic system , fracture (geology) , structural engineering , optoelectronics , electrical engineering , layer (electronics) , engineering , telecommunications , linguistics , philosophy

The fracture of silicon cells is a common reliability issue found in silicon‐based photovoltaic (PV) modules. Cracks initiate and propagate as a result of high residual stresses in silicon cells and cause power losses. In this study, the stresses in the longitudinal cross‐section of a PV laminate during the soldering and lamination processes are simulated and studied. A parametric study of the effect of interconnect thickness and yield strength is also performed and the results show that a peak maximum stress is reached at a certain interconnect to cell thickness ratio.

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