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Microstructure and Properties of C/SiC‐Diamond Composites Prepared by the Combination of CVI and RMI
Author(s) -
Li Jingxin,
Liu Yongsheng,
Nan Beiya,
Zhao Zhifeng,
Feng Wei,
Zhang Qing,
Cheng Laifei
Publication year - 2019
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201800765
Subject(s) - materials science , diamond , composite material , microstructure , thermal conductivity , silicon carbide , chemical vapor infiltration , ceramic
Diamond modified continuous carbon fiber reinforced silicon carbide (C/SiC‐Diamond) composites are prepared using a combination of chemical vapor infiltration (CVI) and reactive melt infiltration (RMI). The effect of the diamond particle size on the microstructure, mechanical properties, and thermophysical properties of C/SiC‐Diamond composites are investigated. A density of 2.05 g cm −3 is achieved for C/SiC‐Diamond composites impregnated with 1 µm diamond particles. A near twofold enhancement of the thermal conductivity (9–10 W (m K) −1 ) and thermal diffusion coefficient (5 mm 2 s −1 ) is obtained, compared with continuous carbon fiber reinforced silicon carbide (C/SiC) composites (5–6 W (m · K) −1 ) prepared by CVI. It is established that the introduction of diamond can improve the thermal conductivity of C/SiC composites and increase the application potential in rocket engines, aerospace vehicles, and brake materials.