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Selective Electron Beam Melting of Oxide Dispersion Strengthened Copper
Author(s) -
Pobel Christoph R.,
Lodes Matthias A.,
Körner Carolin
Publication year - 2018
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201800068
Subject(s) - materials science , copper , scanning electron microscope , dispersion (optics) , microscale chemistry , copper oxide , oxide , fabrication , cathode ray , metallurgy , phase (matter) , chemical engineering , composite material , electron , optics , chemistry , medicine , physics , mathematics education , mathematics , alternative medicine , organic chemistry , pathology , quantum mechanics , engineering
An oxide dispersion strengthened (ODS) copper powder containing 5 vol% Al 2 O 3 as finely dispersed particles is processed by selective electron beam melting (SEBM), a powder bed based additive manufacturing technology. Contrary to usual powder characteristics used for SEBM, the particles show a non‐spherical morphology and a copper oxide layer on their surface. A preheating strategy as well as melting parameters for successful generation of ODS‐Cu samples is developed to achieve processability despite the adverse powder conditions. Specimens are built and their meso‐ and microscale structures are analyzed by optical microscopy (OM) and scanning electron microscopy (SEM) as well as energy dispersive X‐ray analyses (EDX). Temperature depending phase separation effects previously encountered in literature during fabrication of ODS‐Cu powders are taken into account.[1][D. L. Zhang, 1999] Alumina particles were found to coagulate during the process. Partly the Al 2 O 3 was melted and separated from the Cu which resulted in heavy demixing of the system and subsequent loss of dispersion strengthening effect.