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High Cooling Rate, Regular and Plate Like Cells in Sn–Ni Solder Alloys
Author(s) -
Xavier Marcella G. C.,
Silva Bismarck L.,
Garcia Amauri,
Spinelli José E.
Publication year - 2018
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201701179
Subject(s) - eutectic system , materials science , ductility (earth science) , metallurgy , dendrite (mathematics) , alloy , soldering , morphology (biology) , phase diagram , phase (matter) , creep , geometry , mathematics , chemistry , organic chemistry , biology , genetics
Broad ranges of cooling rates ( T ˙ ) 0.8–30.5 and 0.4–5.0 K s −1 are attained during directional solidification of eutectic Sn–0.2 wt% Ni and hypereutectic Sn–0.5 wt% Ni alloys, respectively. A reverse high cooling rate cell‐to‐dendrite transition occurs for the eutectic composition and a transition from high cooling rate cells to plate like cells for the hypereutectic alloy. High cooling rate β ‐Sn cells are associated with cooling rates >5.5 and >2.7 K s −1 for eutectic and hypereutectic compositions, respectively. A processing diagram, relating the ‘ T ˙ –Ni content’ space with the microstructural morphology, is proposed. A combination of plate like cells and plate NiSn 4 eutectic phase results in higher ductility.