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Cu Nanospring Films for Advanced Nanothermal Interfaces
Author(s) -
Antartis Dimitrios A.,
Mott Ryan N.,
Das Debashish,
Shaddock David,
Chasiotis Ioannis
Publication year - 2018
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201700910
Subject(s) - materials science , thermal conductivity , composite material , thermal stability , elastic modulus , spring (device) , thermal , shear modulus , polymer , modulus , thermodynamics , chemical engineering , physics , engineering
An advanced thermal interface material comprised of dense and orderly arrays of 10‐µm high Cu nanosprings with tunable normal and shear compliance, lateral stability due to spring intertwining, and thermal resistance below 1 mm 2 KW −1 is presented. The Cu nanospring films possess the compliance of soft polymers but up to 100 times higher thermal conductivity than materials with similar elastic modulus. This unique combination of mechanical and thermal properties makes it possible for the first time to populate the large empty space in the materials selection chart of thermal conductivity versus elastic modulus.