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Enhanced Mechanical Properties of Multilayered Cu with Modulated Grain Size Distribution
Author(s) -
Zheng Bo,
Shen Xixun,
Jiao Huisheng,
Xu Qunjie,
Cheng Danhong
Publication year - 2018
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201700849
Subject(s) - materials science , ductility (earth science) , ultimate tensile strength , scanning electron microscope , composite material , transmission electron microscopy , grain size , copper , microstructure , strengthening mechanisms of materials , strain hardening exponent , metallurgy , nanotechnology , creep
A bulk multilayered copper with nano‐sized grains (NG) as hard layer and ultrafine grains (UFG) as soft layer with the thickness ratio of about 10:1 is synthesized by electrodeposition. Microstructural studies by scanning electron microscope (SEM) and transmission electron microscope (TEM) reveal the alternating growth of well‐defined layers with either nano‐grains or ultrafine‐grains. Tensile tests reveal that the layered nanostructured Cu exhibits an enhanced ductility of near 17.5% and high ultimate tensile strength of about 700 MPa. The multilayered Cu exhibits a higher ductility without obvious loss of strength compared to the monolithic nano‐grained Cu. The enhanced ductility is primarily attributed to two effects including the increased strain hardening ability and the effective adjustment to the local stress concentration brought by the periodic existence of the UFG layer in the NG matrix.