Premium
Mechanical and Electromagnetic Interference Shielding Behavior of C/SiC Composite Containing Ti 3 SiC 2
Author(s) -
Fan Xiaomeng,
Yin Xiaowei,
Cai Yanzhi,
Zhang Litong,
Cheng Laifei
Publication year - 2018
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201700590
Subject(s) - materials science , emi , electromagnetic shielding , electromagnetic interference , composite material , ultimate tensile strength , composite number , electrical resistivity and conductivity , electronic engineering , electrical engineering , engineering
In order to obtain the composites with the integration of structural and functional properties, Ti 3 SiC 2 is introduced into C/SiC due to its excellent damage tolerance and electromagnetic interference (EMI) shielding properties. C/SiC–Ti 3 SiC 2 has the lower tensile strength, while the higher compressive strength than C/SiC. The penetration energy of C/SiC–Ti 3 SiC 2 in the impact experiment is improved at least three times than that of C/SiC, resulting from the improved damage tolerance. With the introduction of Ti 3 SiC 2 , the EMI shielding effectiveness increases from 31 to 41 dB in X‐band (8.2 to 12.8 GHz) due to the increase of electrical conductivity. C/SiC–Ti 3 SiC 2 reveals the great potential as structural and functional materials based on the multi‐functional properties.