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Ag@Sn Core‐Shell Powder Preform with a High Re‐Melting Temperature for High‐Temperature Power Devices Packaging
Author(s) -
Yu Fuwen,
Wang Bin,
Guo Qiang,
Ma Xin,
Li Mingyu,
Chen Hongtao
Publication year - 2018
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201700524
Subject(s) - materials science , thermal shock , ductility (earth science) , composite material , core (optical fiber) , electrical conductor , melting temperature , die (integrated circuit) , shear strength (soil) , thermal , nanotechnology , creep , environmental science , physics , meteorology , soil science , soil water
In this paper, the authors propose a highly conductive die attach material based on Ag@Sn powder for power devices operating at high temperatures or in other harsh environments. The preform can be reflowed at 250 °C (18 °C above the T m of Sn, 232 °C), but the resulting bondline can sustain high temperatures up to 400 °C with a high shear strength due to the high re‐melting temperature of the formed Ag 3 Sn ( T m = 480 °C) after the complete consumption of the outer Sn layers. In addition, the formed bondline exhibits excellent electrical and thermal conductivities due to the embedded Ag particles in the interconnections. The interconnections also exhibit excellent reliability under thermal shock cycling from −55 to 200 °C because of the increased bondline thickness and inherent ductility of the Ag particles embedded in the Ag 3 Sn.