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Microstructure and Texture Development in Al–3%Brass Composite Produced through ARB
Author(s) -
Tolouei Ehsan,
Toroghinejad Mohammad Reza,
Asgari Hamed,
Monajati Zadeh Hossein,
Ashrafizadeh Fakhreddin,
Szpunar Jerzy A.,
Bocher Philippe
Publication year - 2018
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201700463
Subject(s) - electron backscatter diffraction , accumulative roll bonding , brass , materials science , microstructure , texture (cosmology) , metallurgy , composite number , copper , diffraction , aluminium , grain size , grain boundary , drop (telecommunication) , composite material , optics , physics , artificial intelligence , computer science , image (mathematics) , telecommunications
In the present work, aluminum‐3% brass composite sheets are produced by accumulative roll bonding (ARB) process up to nine passes at ambient temperature. Evolution of rolling texture is studied by texture measurement using X‐ray diffraction method. The results show that ARB process leads to the formation of copper ({112} <111>) and Dillamore ({4 4 11} <11 11 8>) as the major texture components. The intensity of copper and Dillamore components enhances to values as high as 19 times that of random with increasing number of passes to 9. It is observed that the 5th pass is a transition in development of the texture components, after which the intensities undergo a drop. The textures are comparable to ARB process of high purity aluminum, indicating that the addition of 3% brass particles do not cause any significant change in the deformation behavior. Electron backscatter diffraction (EBSD) technique is used to examine the microstructure; the results reveal formation of ultrafine grains (UFG), starting in the 3rd pass and covers the entire structure after the 5th pass. The major mechanisms involved are identified as rotation of the sub‐grains, as well as grain boundary migration.