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Ferromagnetic Film − Substrate Decoupling for Sensor Applications
Author(s) -
Beirle Stefan,
Seemann Klaus,
Leiste Harald,
Ulrich Sven
Publication year - 2017
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201700397
Subject(s) - materials science , ferromagnetic resonance , ferromagnetism , magnetic anisotropy , ferromagnetic material properties , condensed matter physics , substrate (aquarium) , coercivity , optoelectronics , composite material , nuclear magnetic resonance , magnetization , magnetic field , oceanography , physics , quantum mechanics , geology
This study presents the decoupling of ferromagnetic properties of Fe–Co–Hf–N films with an in‐plane uniaxial anisotropy from ferromagnetic cemented carbide (WC–Co) substrates by predepositing a non‐ferromagnetic buffer layer between the substrate and the film. Due to the ferromagnetic Co content in the substrate, a magnetic coupling effect arises which suppresses the natural ferromagnetic resonance of the Fe 32 Co 45 Hf 11 N 12 film at a frequency of 2.13 GHz. The deposition of a non‐ferromagnetic, electrically conductive TiN layer, or a non‐ferromagnetic, electrically insulating SiO 2 layer between the substrate and the soft ferromagnetic film shows decoupling regarding the static ferromagnetic properties, so that the formation of an in‐plane uniaxial anisotropy is possible. With regard to the application as a high‐frequency sensor the paper shows that with increasing the thickness of the electrically insulating SiO 2 buffer layer the full width at half maximum (FWHM) of the resonance line becomes much sharper, in contrast to the electrically conductive TiN. The explanation was attributed to the formation of eddy‐currents in the electrically conductive material causing a magnetic field which disturbs the uniform precession of the magnetic moments. The high‐frequency properties of the decoupled film system are promising for a thermal and mechanical stress sensor system on cutting tools.

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