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Small Y Addition Effects on Hot Deformation Behavior of Copper‐Matrix Alloys
Author(s) -
Zhang Yi,
Sun Huili,
Volinsky Alex A.,
Wang Bingjie,
Tian Baohong,
Chai Zhe,
Liu Yong,
Song Kexing
Publication year - 2017
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201700197
Subject(s) - materials science , dynamic recrystallization , flow stress , strain rate , deformation (meteorology) , microstructure , dissipation , metallurgy , alloy , composite material , activation energy , stress (linguistics) , hot working , thermodynamics , physics , chemistry , linguistics , organic chemistry , philosophy
Hot deformation behavior of two alloys, Cu–Zr and Cu–Zr–Y i s studied by compression tests using the Gleeble‐1500D thermo‐mechanical simulator. Experiments a re conducted at 550–900 °C temperature and 0.001–10 s − 1 strain rate. The true stress–true strain curves a re analyzed, and the results show that the flow stress strongly depends on the temperature and the strain rate. Furthermore, both alloys behave similarly when the flow stress increases with higher strain rate and lower temperature. Based on the dynamic material model, the processing maps a re obtained at strains of 0.4 and 0.5. The optimal processing parameters for the Cu–Zr and Cu–Zr–Y alloys a re determined. In addition, the constitutive equations for the alloys a re established to characterize the flow stress as a function of strain rate and deformation temperature. Based on the microstructure evolution analysis, the results show that the addition of Y can effectively promote dynamic recrystallization. Moreover, the processability of the alloy can be optimized. Thermal deformation activation energy and the peak power dissipation efficiency for the alloys a re obtained. It i s observed that the addition of Y effectively improves thermal deformation activation energy and has considerable influence on the peak power dissipation efficiency.