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Study of Interfacial Interactions in Physically Transient Soft Layered Structures: A Step toward Understanding Interfacial Bonding and Failure in Soft Degradable Structures
Author(s) -
Chen Yuanfen,
Jamshidi Reihaneh,
Hong Wangyujue,
Hashemi Nicole N.,
Montazami Reza
Publication year - 2017
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201700139
Subject(s) - materials science , electrode , transient (computer programming) , fragmentation (computing) , composite material , electronics , nanotechnology , computer science , electrical engineering , chemistry , engineering , operating system
Soft multilayer structures have broad applications in transient electronics. Strain‐mismatch‐induced fracture is key in achieving physical transiency. Here, swelling‐mismatch‐induced fragmentation of physically transient electrodes is studied. The fragment size of the electrode layer as a function of initial defect distribution is investigated. The average fragment size is predicted and verified by a combination of experimental and FEM analysis. It is found that only large defects initiate fragmentation; this concept can be used to control disintegration of physically transient electronics by means of materials and design, and can be extended to study transiency of soft multilayer structures.