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Front Cover: Advanced Engineering Materials 2∕2016
Publication year - 2016
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Reports
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201670005
Subject(s) - front cover , cover (algebra) , citation , front (military) , copper , library science , engineering physics , computer science , materials science , mechanical engineering , physics , engineering , metallurgy
The cover shows an ultrafine‐grained pure copper with an average grain size of 250 nm after HPT processing through 10 turns. The present research confirms that there is an excellent potential for using the UFG pure copper for applications in micro‐forming technology. Further details can be found in the article by J. Xu, T. G. Langdon and co‐workers on page 241 .