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Initiated Chemical Vapor Deposition of Polymer Films at High Process Temperature for the Fabrication of Organic/Inorganic Multilayer Thin Film Encapsulation
Author(s) -
Kim Bong Jun,
Seong Hyejeong,
Shim Hyunjeong,
Lee Young Il,
Im Sung Gap
Publication year - 2017
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201600870
Subject(s) - fabrication , materials science , chemical vapor deposition , atomic layer deposition , thin film , polymer , deposition (geology) , combustion chemical vapor deposition , chemical engineering , nanotechnology , carbon film , composite material , medicine , paleontology , alternative medicine , pathology , sediment , engineering , biology
For the fabrication of thin film encapsulation (TFE), sequential deposition of organic and inorganic layers is inevitable. A single‐chamber system of initiated chemical vapor deposition (iCVD) and atomic layer deposition (ALD) is reported previously. Here, the substrate temperature ( T s ) of the iCVD is aligned with that of ALD to facilitate the transition of the deposition mode by removing delays caused by repeated heating/cooling of the substrate. While increasing the T s of iCVD from 40 to 90 °C, the process pressure is optimized so that the properties of the organic film are unchanged from that deposited with 40 °C. The T s alignment significantly reduced the time delay during transition of the deposition mode, and the fabrication of the TFE is expedited.