Premium
Substrate Independent Elastic Modulus of Thin Low Dielectric Constant Materials
Author(s) -
Okudur Oguzhan Orkut,
Vanstreels Kris,
de Wolf Ingrid,
Hangen Ude,
Qiu Anqi
Publication year - 2017
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201600653
Subject(s) - nanoindenter , materials science , elastic modulus , composite material , dielectric , thin film , finite element method , nanoindentation , indentation , modulus , substrate (aquarium) , porosity , nanotechnology , structural engineering , optoelectronics , oceanography , geology , engineering
The elastic modulus of a variety of porous low dielectric constant thin films with porosities in the range of 24–47% and thicknesses between 148 and 235 nm is calculated using the Oliver–Pharr method, an intrinsic thin film model based on the Li‐Vlassak method, and finite element simulations in the elastic regime by taking the tip imperfections into account. It is shown that the substrate effects are significant even at shallow indentation depths and strongly depend on the nanoindenter geometry. Elastic modulus values extracted from the intrinsic thin film model and finite element simulations, although based on different approaches, are found to be very similar and independent of the nanoindenter geometry.