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The TiC/Ni–Cr Composites with Low Thermal Expansion and Electrical Resistivity Applied for IT‐SOFC Interconnects
Author(s) -
Qi Qian,
Liu Yan,
Zhang Hui,
Zhao Jing,
Gai Linlin,
Huang Zhengren
Publication year - 2016
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201600190
Subject(s) - materials science , isothermal process , electrical resistivity and conductivity , composite material , contiguity , thermal expansion , microstructure , thermal conductivity , thermodynamics , electrical engineering , ecology , physics , biology , engineering
The TiC/Ni–Cr composites are promising candidates for IT‐SOFC interconnects. In this paper, the TiC/Ni–Cr composites are fabricated by pressureless infiltration, and in order to increase the contiguity of TiC, the partial in situ method and isothermal heat treatment are used. The results show that with the increase of in situ TiC from 10 (TG1) to 20 wt% (TG2), the thermal expansion (CTE) decreases by 0.1 × 10 –6 °C –1 , and electrical resistivity ( σ ) decreases from 5.23 × 10 –3 to 1.59 × 10 –3 Ω cm and from 2.23 × 10 –3 to 0.93 × 10 –3 Ω cm with isothermal heat treatment. By contrast, the isothermal heat treatment at 1 300 °C for 20 min can nearly doubly increase the contiguity of TiC. The CTE shows decrease by 0.4 × 10 –6 °C –1 , and ( σ decreases from 5.23 × 10 –3 to 2.23 × 10 –3 Ω cm in TG1 and from 1.59 × 10 –3 to 0.93 × 10 –3 Ω cm in TG2.