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Back Cover: Advanced Engineering Materials 8∕2015
Publication year - 2015
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201570031
Subject(s) - creep , materials science , cover (algebra) , eutectic system , tin , compression (physics) , computer science , microstructure , engineering physics , mechanical engineering , composite material , physics , engineering , metallurgy
Micromechanical testing enables us to determine the mechanical properties of small volumes, microstructural phases, and constituents. Although traditionally limited to time independent deformation, we have now used the micropillar compression technique to characterize the stress and temperature dependent creep properties of microscopic phases (shown in the graph). Many materials, such as Sn‐Ag solder alloys, have complex inhomogeneous microstructures (as shown in the background). For the first time ever, this new technique allowed us to probe and understand the creep properties of individual constituents, in this case pure tin and eutectic regions (shown in the inset SEM images). For details see the article by N. Chawla and co‐workers on page 1168 .