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Microstructural Evolution and Micro‐Compression in High‐Purity Copper Processed by High‐Pressure Torsion
Author(s) -
Li Jianwei,
Xu Jie,
Wang Chuan Ting,
Shan Debin,
Guo Bin,
Langdon Terence G.
Publication year - 2016
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201500488
Subject(s) - materials science , microstructure , electron backscatter diffraction , severe plastic deformation , torsion (gastropod) , copper , diffraction , composite material , metallurgy , grain size , shear (geology) , compression (physics) , optics , medicine , physics , surgery
Pure copper is subjected to severe plastic deformation at room temperature using quasi‐constrained high‐pressure torsion through 1/4 to 10 turns. The evolution of the microstructure is monitored using X‐ray diffraction and electron backscatter diffraction. Specimens are analyzed both before and after micro‐compression of ≈50%. The results show that after 10 turns there is a homogeneous ultrafine‐grained (UFG) microstructure with an average grain size of ≈250 nm and with a simple shear texture. The micro‐compression testing shows that UFG specimens exhibit a better surface quality after compression thereby demonstrating an excellent potential for using UFG copper in micro‐forming.