z-logo
Premium
Microstructural Evolution and Micro‐Compression in High‐Purity Copper Processed by High‐Pressure Torsion
Author(s) -
Li Jianwei,
Xu Jie,
Wang Chuan Ting,
Shan Debin,
Guo Bin,
Langdon Terence G.
Publication year - 2016
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201500488
Subject(s) - materials science , microstructure , electron backscatter diffraction , severe plastic deformation , torsion (gastropod) , copper , diffraction , composite material , metallurgy , grain size , shear (geology) , compression (physics) , optics , medicine , physics , surgery
Pure copper is subjected to severe plastic deformation at room temperature using quasi‐constrained high‐pressure torsion through 1/4 to 10 turns. The evolution of the microstructure is monitored using X‐ray diffraction and electron backscatter diffraction. Specimens are analyzed both before and after micro‐compression of ≈50%. The results show that after 10 turns there is a homogeneous ultrafine‐grained (UFG) microstructure with an average grain size of ≈250 nm and with a simple shear texture. The micro‐compression testing shows that UFG specimens exhibit a better surface quality after compression thereby demonstrating an excellent potential for using UFG copper in micro‐forming.

This content is not available in your region!

Continue researching here.

Having issues? You can contact us here