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Recrystallization Behavior at Diffusion Bonding Interface of High Nb Containing TiAl Alloy
Author(s) -
Tang Bin,
Qi Xian Sheng,
Kou Hong Chao,
Li Jin Shan,
Milenkovic Srdjan
Publication year - 2016
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201500457
Subject(s) - materials science , recrystallization (geology) , microstructure , diffusion bonding , alloy , nucleation , dynamic recrystallization , lamellar structure , metallurgy , composite material , direct shear test , shear (geology) , crystallography , hot working , thermodynamics , paleontology , physics , biology , chemistry
A series of diffusion bonding tests are conducted on a high Nb containing TiAl alloy with full lamellar (FL) microstructure and the effect of interfacial recrystallization behavior on the shear strength is discussed. Microstructural observations reveal that bonding above 1 100 °C and 30 MPa results in recrystallization at the bonding interface flanked by FL microstructure, thus promoting the interface migration and leading to a sound joint. Based on the present results, the nucleation mechanism of recrystallization at the bonding interface is studied. Shear testing results show that recrystallization at the bonded zone improves the bonding quality of the joints by changing the failure mode. The shear strength of the joints attains 400 MPa when bonding at 1 150 °C/30 MPa/45 min and 1 100 °C/40 MPa/45 min.