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Effect of Carbon/Carbon Preform Density on the Microstructure and Properties of Mo 2 C Interlayer‐Modified Carbon/Carbon–Copper Composites for Sliding Contact Materials
Author(s) -
Zhou Wen Yan,
Ran Li Ping,
Peng Ke,
Ge Yi Cheng,
Wu Huang,
Yi Mao Zhong
Publication year - 2016
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201500172
Subject(s) - materials science , composite material , flexural strength , microstructure , reinforced carbon–carbon , carbon fibers , copper , tribology , toughness , composite number , metallurgy
Carbon/carbon–copper(C/C‐Cu) composites were fabricated by pressure‐less infiltration of Cu into carbon/carbon (C/C) preforms modified with Mo 2 C interlayer by a molten salt method. Cu filled the pores inside the Mo 2 C‐modified preforms fully, and retained an interconnected net‐like distribution in the C/C‐Cu composites. The electrical resistivity and flexural strength increased, whereas impact toughness decreased with the increase of preform density. Fiber pull‐out and crack propagation along the interface contributed to the pseudo‐plastic behavior of the composites. The tribological performance was improved with the increase of preform density due to the better lubrication of transfer films.