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Interfacial Energy Effect on the Distribution of Ag 3 Sn in Full Intermetallic Joints
Author(s) -
Yang TingLi,
Zhu ZiXuan,
Yu JenJui,
Lin YanFu,
Kao C. Robert
Publication year - 2015
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201500153
Subject(s) - intermetallic , materials science , grain boundary , phase (matter) , metallurgy , distribution (mathematics) , composite material , microstructure , alloy , mathematical analysis , chemistry , mathematics , organic chemistry
Intermetallics, including Cu 6 Sn 5 , Ni 3 Sn 4 , and Ag 3 Sn, are to be used for structural applications in microjoints of three‐dimensional integrated circuits. However, the phase distribution behavior of Ag 3 Sn particles in Cu 6 Sn 5 is very different from that in Ni 3 Sn 4 . It is shown for the first time that the interfacial free energies between these intermetallics are responsible for this difference. It is found that the interfacial energy between Cu 6 Sn 5 and Ag 3 Sn is very low, even lower than the Cu 6 Sn 5 grain boundary energy.