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Inside Front Cover: Advanced Engineering Materials 5∕2014
Publication year - 2014
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Reports
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201470025
Subject(s) - front cover , cover (algebra) , front (military) , materials science , computer science , engineering physics , computer graphics (images) , nanotechnology , physics , mechanical engineering , engineering
The Inside Cover graphic shows the scheme of an in‐situ study of degradation and failure mechanisms of time dependent dielectric breakdown (TDDB) in copper/ultra‐low‐k interconnect stacks of chips, applying transmission X‐ray microscopy and scanning transmission electron microscopy. For further details see the article by Zhongquan Liao et al. on page 486.