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Grain Boundary Phenomena in an Ultrafine‐Grained Al–Zn Alloy with Improved Mechanical Behavior for Micro‐Devices
Author(s) -
Chinh Nguyen Q.,
Valiev Ruslan Z.,
Sauvage Xavier,
Varga Gábor,
Havancsák Károly,
Kawasaki Megumi,
Straumal Boris B.,
Langdon Terence G.
Publication year - 2014
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201300450
Subject(s) - materials science , grain boundary , microstructure , grain boundary sliding , grain boundary strengthening , alloy , focused ion beam , scanning electron microscope , transmission electron microscopy , severe plastic deformation , metallurgy , accumulative roll bonding , grain size , composite material , nanotechnology , ion , physics , quantum mechanics
The microstructural and mechanical properties of an ultrafine‐grained (UFG) Al–Zn alloy processed by high‐pressure torsion (HPT) are investigated using depth‐sensing indentations, focused ion beam, scanning electron microscopy and scanning transmission electron microscopy. Emphasis is placed on the microstructure and the effects of grain boundaries at room temperature. The experiments show the formation of Zn‐rich layers at the Al/Al grain boundaries that enhance the role of grain boundary sliding leading to unique plastic behavior in this UFG material. The occurrence of significant grain boundary sliding at room temperature is demonstrated by deforming micro‐pillars. Our results illustrate a potential for using UFG materials as advanced functional materials in electronic micro‐devices.