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Dislocation Evolution in Nanograins during Successive Stress Relaxation
Author(s) -
Wang Guoyong,
Lian Jianshe
Publication year - 2014
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201300300
Subject(s) - nanocrystalline material , materials science , copper , dislocation , stress relaxation , hardening (computing) , strain hardening exponent , metallurgy , composite material , severe plastic deformation , relaxation (psychology) , creep , nanotechnology , microstructure , layer (electronics) , psychology , social psychology
Whether low strain hardening is an intrinsic behavior of nc metals is still an open question. To make clear this issue, in this paper repeated stress relaxation experiments were performed on a nanocrystalline and coarse‐grained copper, respectively. The mobile dislocation density during plastic strain, which directly determines the performance of strain hardening, was deduced from this experiment. The mobile dislocation density of nanocrystalline copper decreased much slower than coarse‐grained copper. The high mobility of the dislocation in nanocrystalline copper indicate the dislocation seldom interact with each other and generate sessile barrier, and render the nanocrystalline copper a more diminutive strain‐hardening capacity than coarse‐grained copper.