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Microstructural Modulations Enhance the Mechanical Properties in Al–Cu–(Si, Ga) Ultrafine Composites
Author(s) -
Park Jin Man,
Pauly Simon,
Mattern Norbert,
Kim Do Hyang,
Kim Ki Buem,
Eckert Jürgen
Publication year - 2010
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.201000155
Subject(s) - materials science , eutectic system , microstructure , composite material , alloy , composite number , phase (matter) , fracture (geology) , metallurgy , chemistry , organic chemistry
Adding small amounts of Si or Ga (3 at.%) to the eutectic Al 83 Cu 17 alloy yields an ultrafine bimodal eutectic composite microstructure upon solidification. The as‐solidified alloys exhibit a distinct microstructural length‐scale hierarchy leading to a high fracture strength of around 1 GPa combined with a large compressive plastic strain of up to 30% at room temperature. The present results suggest that the mechanical properties of the ultrafine bimodal eutectic composites are strongly related to their microstructural characteristics, namely phase evolution, length‐scales, and distribution of the constituent phases.