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Effects of Aging on Interfacial Microstructure and Reliability Between SnAgCu Solder and FeNi/Cu UBM
Author(s) -
Zhu QingSheng,
Guo JianJun,
Shang PanJu,
Wang ZhongGuang,
Shang JianKu
Publication year - 2010
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200900294
Subject(s) - materials science , soldering , microstructure , intermetallic , joint (building) , metallurgy , brittleness , shear strength (soil) , composite material , brittle fracture , drop (telecommunication) , fracture (geology) , alloy , structural engineering , environmental science , soil science , engineering , soil water , telecommunications , computer science
Effects of thermal aging on the interfacial microstructure and reliability of the SnAgCu/FeNi‐Cu joint are investigated. It is found that aging effects depends strongly on the temperature. Aging at low temperature, e.g., at 125 °C, a submicron meter thick FeSn 2 IMC layer formed at the SnAgCu/FeNi‐Cu interface during reflowing grows at a rate twenty times slower than the growth rate of the IMC at the SnAgCu/Cu interface. At high temperature, e.g., at 180 °C, the Cu element is found to diffuse through FeNi layer to produce the (Cu, Ni) 6 Sn 5 IMC and this IMC layer grows even faster than the IMC at the SnAgCu/Cu interface. Solder ball shear test results show that the SnAgCu/FeNi‐Cu joint has a comparable strength to the SnAgCu/Cu joint after reflowing, and the strength drop after aging at 125 °C is less than that of the SnAgCu/Cu joint. However, after aging at 180 °C, the strength of the SnAgCu/FeNi‐Cu joint is degraded to a low value, along with a shift in failure mode from the solder fracture to the brittle intermetallics fracture.

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