Premium
Fabrication and Microstructure of C/Cu Composites
Author(s) -
Liu Yiwen,
Zhang Chengyu,
Qiao Shengru,
Yang Zhimao
Publication year - 2010
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200900288
Subject(s) - materials science , microstructure , wetting , composite material , fabrication , alloy , high resolution transmission electron microscopy , infiltration (hvac) , chemical vapor infiltration , reinforced carbon–carbon , composite number , transmission electron microscopy , nanotechnology , medicine , alternative medicine , pathology
C/Cu composites were prepared by a melting infiltration technique in vacuum. In order to improve the wettability between Cu and carbon fibers, Ti (8 wt.‐%) and Cr (1 wt.‐%) were added to the Cu alloy. Microstructures of the composites and interface between C and Cu were investigated by XRD, SEM, EDS and HRTEM. The results show that the Ti and Cr improved the wettability between Cu and CC preform and the infiltration ability of Cu into CC preform greatly. The prepared C/Cu composites are characterized as having good interface bonding and high density. In the process of infiltration, Ti and Cr concentrate on the boundary of carbon fiber. Formation of TiC results from the reaction of Ti and C between Cu and carbon fiber.