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In Situ and Ex Situ Nanomechanical Analysis of Reactive Nanolayer Solder Joints
Author(s) -
Tong Michael,
Sriram Vinay,
Minor Andrew,
Yang JennMing
Publication year - 2009
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200900102
Subject(s) - materials science , nanoindentation , nial , soldering , in situ , composite material , intermetallic , ductility (earth science) , slip (aerodynamics) , metallurgy , residual stress , modulus , creep , physics , alloy , meteorology , thermodynamics
The nanomechanical behavior of NiAl derived from explosively RNLs in reactive solder joints is studied using in situ nanocompression and nanoindentation. We report the direct analysis of <011> slip and discuss the role it plays in the much disputed ductility of NiAl. The hardness, modulus, and residual stress in the NiAl layer are studied by load‐displacement curve analysis.