In Situ and Ex Situ Nanomechanical Analysis of Reactive Nanolayer Solder Joints | Zendy

Tong Michael | Zendy; Sriram Vinay | Zendy; Minor Andrew | Zendy; Yang JennMing | Zendy

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In Situ and Ex Situ Nanomechanical Analysis of Reactive Nanolayer Solder Joints

Author(s) -

Tong Michael,

Sriram Vinay,

Minor Andrew,

Yang JennMing

Publication year - 2009

Publication title -

advanced engineering materials

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.938

H-Index - 114

eISSN - 1527-2648

pISSN - 1438-1656

DOI - 10.1002/adem.200900102

Subject(s) - materials science , nanoindentation , nial , soldering , in situ , composite material , intermetallic , ductility (earth science) , slip (aerodynamics) , metallurgy , residual stress , modulus , creep , physics , alloy , meteorology , thermodynamics

The nanomechanical behavior of NiAl derived from explosively RNLs in reactive solder joints is studied using in situ nanocompression and nanoindentation. We report the direct analysis of <011> slip and discuss the role it plays in the much disputed ductility of NiAl. The hardness, modulus, and residual stress in the NiAl layer are studied by load‐displacement curve analysis.

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