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Advanced Experimental and Simulation Approaches to Meet Reliability Challenges of New Electronics Systems
Author(s) -
Vogel Dietmar,
Auersperg Jürgen,
Michel Bernd
Publication year - 2009
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200800330
Subject(s) - physics of failure , reliability (semiconductor) , tracing , reliability engineering , computer science , electronics , interface (matter) , key (lock) , fracture (geology) , stress (linguistics) , mechanical engineering , materials science , engineering , power (physics) , linguistics , physics , electrical engineering , computer security , philosophy , bubble , quantum mechanics , maximum bubble pressure method , parallel computing , composite material , operating system
Abstract This paper focuses on some advanced aspects of physics of failure approaches. Tracing of failure modes under realistic loading is a key issue to separate relevant failure sites to be studied in more detail. In the past design of experiment (DoE) tools have been developed to handle this problem. They allow to optimize design and/or material selection with respect to different failure mechanisms and sites. The application of these methods is demonstrated by optimizations performed for fracture problems. Interface fracture has been chosen as one of the most important failure mechanisms. Finally, local stress and strain measurement tools developed over the past years are presented at the end of the paper. They are tools to validate simulation results and therefore the underlying mechanical modeling. Namely, local stress measurement tools under development are needed to make realistic assumptions of loading conditions and to provide residual stress data for FEA.