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Reliability Aspects of Microsystems for Automotive Applications
Author(s) -
MüllerFiedler Roland,
Nötzold Kerstin,
Schneider Arnold,
Rank Holger,
Graf Jürgen
Publication year - 2009
Publication title -
advanced engineering materials
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.938
H-Index - 114
eISSN - 1527-2648
pISSN - 1438-1656
DOI - 10.1002/adem.200800290
Subject(s) - microsystem , automotive industry , reliability (semiconductor) , microelectromechanical systems , electronic packaging , materials science , mechanical engineering , computer science , manufacturing engineering , systems engineering , reliability engineering , engineering , nanotechnology , aerospace engineering , power (physics) , physics , quantum mechanics , composite material
The implementation of microsystems in automotive applications is certainly one of the driving forces for the success of MEMS as an industrial technology on mass production level. In many cases, automotive systems based on microsensors are critical to safety. Consequently, microsystems have to assure an accurate, reliable, and failsafe operation during the entire lifetime of the vehicle. Since, the car represents a harsh environment for electronic or mechanical systems and components, reliability issues of MEMS have moved more and more into the focus of research and development. In particular, reliability aspects related to packaging and assembly have become a key issue in lifetime investigations. The packaging of microsystems comprises a variety of materials and material combinations, that directly affect the stability of MEMS components. Therefore, sophisticated characterization methods are needed to extract the reliability‐relevant material parameters. This paper gives an introduction into investigations of the stability assessment of glass frit bonding as well as new bonding technologies based on metallic sealing of MEMS devices.